Dr Han Byung Joon
CEO & Co-Founder
Silicon Box Pte Ltd
Former Chairman & CEO of JCET STATS ChipPAC
Inventor of Semiconductor packaging products most used in market
Led team who produced highest volume fanout, SiP and 3D products in the world
Has written over 50 publications
Holds over 300 patents
Dr. Byung-Joon (BJ) Han is co-founder and CEO @ Silicon Box. He served as Chief Technology Officer, President, Chief Executive Officer, and Chairman of the Board for JCET STATS Chippac – the world’s No. 3 OSAT – where he worked for twenty years (1999-2019). During that time, he grew revenue at STATS Chippac from $100M to $4.3B by transforming Singapore--based STATS into a global company.Dr. Han is the inventor of semiconductor packaging products, currently shipping 100B+ per year in unit volume, including quad flat no-lead (QFN). He has led teams that have won awards for technological breakthroughs in the space.
Dr. Han brings his considerable know-how and expertise in advanced packaging to Silicon Box, and to address the current lack of chiplet integration infrastructure.
Dr. Han served as Group Chairman of the Technology Strategy Committee overseeing technology direction for the JCET group of companies. In the prior 14 years, he held positions at AT&T Bell Labs, IBM Research, and Anam Semiconductor (later Amkor, world’s No. 2 OSAT).
Dr. Han is a consultant at Bain and holds directorships at several important semiconductor firms and innovation initiatives. Dr. Han was a member of the main committee for Singapore President’s Science and
Technology Awards, a member of the National Research Foundation of Singapore and a Director at the Intellectual Property Office of Singapore. He served as Director for the International Electronics Manufacturing Initiative from 2005-2017. Dr. Han holds over 300 patents.
Dr. Han received his PhD from Columbia University in the City of New York, and completed the Advanced Management Program at Harvard University.
Keynote Address: Advanced Packaging: New era of efficient production in semiconductor interconnection
16 May 2024 0910 - 0935
Moore’s Law has reached it’s limits (!) causing massive disruption to semiconductor supply chains and bottlenecks in advanced chip manufacturing. Where are we? How did we get here? And what is the industry doing to overcome the critical challenges to support and scale the most promising technologies of tomorrow? AI, LLMs, electronic vehicles, mobile, healthcare, space industries… you name it.
In the New Era of Efficient Semiconductor Interconnection webinar, Silicon Box CEO and co-founder, Dr. Byung Joon (BJ) Han will discuss his perspective on the state of the industry, and how advanced packaging is increasingly being seen as the answer to the previous questions. Dr. Han will discuss current technical concepts and paradigm shifts he’s witnessed in semiconductor manufacturing that are culminating in this moment; and how various industry stakeholders and students in design, engineering and business, can take advantage of chiplet architecture and the latest in advanced packaging solutions to advance creativity, take meaningful risks, and reap rich rewards from the next-gen applications they will empower.
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*Please note that the event schedule is subject to change without prior notice.
The event is organised by Technology Development Centre at ITE College Central
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