Mr. SS Kang is the Head of Innovation at BL SEMI Heraeus Electronics in Singapore. Leading teams in next-generation material development for advanced packaging, die attach, sintering, and wire bond applications, he drives innovation in assembly package material solutions. With extensive 25years experience in semiconductor industry like ASM, ASE, K&S, and JCET (Stats ChipPAC), Mr. Kang excels in equipment, package development, and assembly process engineering. His academic credentials include a master’s degree in Management of Technology and an EMBA from the National University of Singapore, reflecting his dedication to advancing technology and leadership in the field.
The Ag sinter technology and application presentation provides a comprehensive overview of the use of silver (Ag) sintering technology in various applications. It covers the advantages and principles of Ag sintering, focusing on its ability to replace traditional soldering methods by enabling high-temperature, pressure-assisted bonding of materials. The presentation highlights the key application areas of Ag sinter technology, including power electronics, automotive, and industrial electronics, emphasizing its potential to improve thermal and mechanical performance. Furthermore, it discusses the process parameters, design considerations, and future developments in Ag sintering, offering valuable insights for engineers and researchers seeking to leverage this innovative bonding technique.
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